PublicOpen · deadline not publishedCN-202608/t20260826_27211280.htmChina· Request For Proposal

Beijing University of Posts and Telecommunications Grain and Silicon Photonic Wafer Bonding Project Competitive Negotiation

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Estimated value: Not disclosed
Earliest action required: Checking…
Bid closes: —
Submission method: Not stated at source

Cn Ccgp · published 26 Aug 2026 · last checked 26 Aug 2026 · no amendments recorded

Scope of works

Competitive negotiation for wafer bonding project.

Published attachments (1)

Full bid documents are not available online. The attachment below is the tender notice only — see the participation requirements above for how to obtain the complete bid pack.

Other attachment — T20260826 27211280Not the complete bid packOpen other attachment

Type: Request for proposal; Request For Proposal
Sector: Telecommunications
Procedure: Competitive Negotiation
Classification: Not published at source
Original notice: Sign in to open the original notice

Key dates

Published at source26 Aug 2026
Submission deadline—