MPA2 Wafer Thinning, Dicing, Pick-and-Place, and Optional Die Tracing

Ref US-RFP348245Advertised27 Sept 2023Closing 20 Oct 2023

Tender Description

Notice type: Solicitation · NAICS 334418 · PSC AJ13 · Place of performance: Batavia, IL MPA2 Wafer Thinning, Dicing, Pick-and-Place, and Optional Die Tracing -

Country: United States
Published: 27 Sept 2023
Closing date: 20 Oct 2023
Procedure: Solicitation

Buyer details

Tender documents

Predictive Analytics

Notice sources

Source provenance (1)

Every portal notice that contributed to this record, with the values each one published. Where portals disagree, the originating notice is the published record.

Portal / reference	Buyer	Published	Deadline	Value	Match
us_samgov US-RFP348245	Sign in to view the buyer	27 Sept 2023	20 Oct 2023	—	Published record